september 2006 rev 2 1/10 10 t2035h series snubberless? high temperature 20 a triacs main features description specifically designed to operate at 150 c, the new 20 a t2035h triacs provide an enhanced performance in terms of power loss and thermal dissipation. this facilitates the optimization of heatsink dimensioning, l eading to improved space and cost effectiveness when compared to electro- mechanical solutions. based on st snubberless? technology, the t2035h series offers high commutation switching capabilities and high noise immunity levels on the full range of t j . the t2035h series facilitat es the optimization of the control of universal motors and inductive loads found in appliances such as vacuum cleaners, and washing machines. the t2035h triacs are also suitable for use in high temperature environment found in hot appliances such as cookers, ovens, hobs, electric heaters, and coffee machines. order code tm: snubberless is a trademark of stmicroelectronics symbol value unit i t(rms) 20 a v drm /v rrm 600 v i gt (q1) 35 ma t j max 150 c part number marking t2035h-600g t2035h-600g t2035h-600g-tr t2035h-600g t2035h-600trg t2035h-600t T2035H-600IRG t2035h-600i a2 a2 a1 g a2 a2 a1 g a2 a1 g a2 a1 g to-220ab t2035h-t d 2 pa k t2035h-g to-220ab insulated t2035h-i www.st.com obsolete product(s) - obsolete product(s)
characteristics t2035h series 2/10 1 characteristics table 1. absolute maximum ratings symbol parameter value unit i t(rms) rms on-state current (full sine wave) d 2 pa k to-220ab t c = 127 c 20 a to-220ab ins t c = 105 c i tsm non repetitive surge peak on-state current (full cycle sine wave, t j initial = 25 c) f = 60 hz t = 16.7 ms 210 a f = 50 hz t = 20 ms 200 i2t i2t value for fusing tp = 10 ms 283 a 2 s di/dt critical rate of rise of on-state current i g = 2xi gt , tr 100 ns f = 120 hz t j = 125 c 50 a/s v dsm /v rsm non repetitive surge peak off state voltage t j = 25 c 700 v i gm peak gate current t p = 20 s t j = 150 c 4 a p g(av) average gate power dissipation t j = 150 c 1 w t stg t j storage junction temperature range operating junction temperature range -40 to +150 -30 to +150 c t i maximum leads soldering temperature during 10 s 260 c table 2. electrical characteristics (t j = 25 c, unless otherwise specified) symbol test conditions quadrant value unit i gt (1) v d = 12 v, r l = 33 ? i - ii - iii max 35 ma v gt i - ii - iii max 1.3 v v gd v d = v drm , r l =3.3 k ?, t j = 150 c i - ii - iii min 0.15 v i h (2) i t = 100 ma max 35 ma i l i g = 1.2 x i gt i - iii max 50 ma ii 80 dv/dt (2) v d = 67% v drm , gate open, t j = 150 c min 300 v/s (di/dt)c (2) without snubber, t j = 150 c min 8.9 a/ms 1. minimum i gt is guaranteed at 5% of i gt max 2. for both polarities of a2 referenced to a1 obsolete product(s) - obsolete product(s)
t2035h series characteristics 3/10 table 3. static electrical characteristics symbol test conditions value unit v tm (1) i tm = 28 a, t p = 380 s tj = 25 c max 1.5 v v to (1) tj = 150 c max 0.80 v r d (1) tj = 150 c max 21 m ? i drm i rrm v drm = v rrm tj = 25 c max 5a tj = 150 c 7.4 ma v d /v r = 400 v (at peak mains voltage) tj = 150 c 4.8 1. for both polarities of a2 referenced to a1 table 4. thermal resistance symbol parameter value unit r th (j-c) junction to case for full (ac) d 2 pa k to-220ab 1 c/w to-220ab ins 1.9 r th (j-a) junction to ambient s = 1 cm2 d 2 pa k 4 5 to-220ab to-220ab ins 60 figure 1. maximum power dissipation vs rms on-state current (full cycle) figure 2. rms on-state current versus case temperature 0 2 4 6 8 10 12 14 16 18 20 22 24 0 2 4 6 8 101214161820 p(w) =180 180 i t(rms) (a) 0 2 4 6 8 10 12 14 16 18 20 22 0 25 50 75 100 125 150 i t(rms) (a) =180 t c (c) to-220ab/d pak 2 to-220ab ins obsolete product(s) - obsolete product(s)
characteristics t2035h series 4/10 figure 3. rms on-state current vs ambient temperature (epoxy printed circuit board fr4 e cu = 35 m) figure 4. relative variation of thermal impedance vs pulse duration 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 25 50 75 100 125 150 i t(rms) (a) =180 s cu =1cm2 t amb (c) 1.e-03 1.e-02 1.e-01 1.e+00 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 k=[z th /r th ] z th(j-a) z th(j-c) t p (s) figure 5. on-state characteristics (maximum values) figure 6. surge peak on-state current vs number of cycles 1 10 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 i tm (a) t j =25c t j =150c t j max. : v t0 = 0.80 v r d = 21 m w v tm (v) 0 20 40 60 80 100 120 140 160 180 200 220 1 10 100 1000 i tsm (a) non repetitive t j initial=25c repetitive t c =127c one cycle t=20ms number of cycles figure 7. non repetitive surge peak on-state current (sinusoidal pulse width tp<10 ms) and value of i2t figure 8. relative variation of gate trigger current, holding current and latching current vs junction temperature (typical values) 100 1000 10000 0.01 0.10 1.00 10.00 i tsm (a), i2t (a2s) tj initial=25c di/dt limitation: 50a/s i tsm i2t t p (ms) 0.0 0.5 1.0 1.5 2.0 2.5 -40 -20 0 20 40 60 80 100 120 140 160 i gt ,i h ,i l [t j ]/i gt ,i h ,i l [t j =25c] i gt i h & i l t j (c) obsolete product(s) - obsolete product(s)
t2035h series characteristics 5/10 figure 9. relative variation of critical rate of decrease of main current (di/dt)c vs reapplied (dv/dt)c figure 10. relative variation of critical rate of decrease of main current (di/dt)c versus junction temperature (di/dt) c [(dv/dt) c ] / specified (di/dt) c 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.1 1.0 10.0 100.0 dv/dt (v/s) (di/dt) c [t j ]/(di/dt) c [t j =125c] 0 1 2 3 4 5 6 7 8 25 50 75 100 125 150 t j (c) figure 11. leakage current versus junction temperature for different values of blocking voltage (typical values) figure 12. acceptable repetitive peak off-state voltage versus case-ambient thermal resistance figure 13. d 2 pak junction to ambient thermal resistance versus copper surface under tab (pcb fr4, copper thickness 35 m) i drm /i rrm (ma) 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 50 75 100 125 150 v drm =v rrm =400 v v drm =v rrm =400 v v drm =v rrm =600 v v drm =v rrm =600 v v drm =v rrm =200 v v drm =v rrm =200 v t j (c) 0 1 2 3 4 5 6 7 8 9 10 300 350 400 450 500 550 600 r th(c-a) (c/w) r th(j-c) =1 c/w (non insulated) t j =150 c r th(j-c) =1.9 c/w (insulated) v drm /v rrm (v) 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 r th(j-a) (c/w) d2pak s cu (cm2) obsolete product(s) - obsolete product(s)
ordering information scheme t2035h series 6/10 2 ordering information scheme t 20 35 h - 600 t (-tr) triac series high temperature voltage package packing mode current sensitivity 20 = 20 a 35 = 35 ma blank = tube (d pak) d pak) 600 = 600 v g = d pak t = to-220ab i = to-220ab insulated -tr = tape and reel ( rg = tube (to-220ab) 2 2 2 obsolete product(s) - obsolete product(s)
t2035h series package information 7/10 3 package information table 5. to-220ab and to-220ab insulated dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 15.20 15.90 0.598 0.625 a1 3.75 0.147 a2 13.00 14.00 0.511 0.551 b 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 c 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 2.40 2.70 0.094 0.106 f 6.20 6.60 0.244 0.259 ?i 3.75 3.85 0.147 0.151 i4 15.80 16.40 16.80 0.622 0.646 0.661 l 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 l3 1.14 1.70 0.044 0.066 m 2.60 0.102 c b2 c2 f ? i l a a1 a2 b e b1 i4 l3 l2 c1 m obsolete product(s) - obsolete product(s)
package information t2035h series 8/10 figure 14. d 2 pak footprint in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect . the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com. table 6. d 2 pak dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 g l l3 l2 b b2 e 2mm min. flat zone a c2 d r a2 v2 c a1 16.90 10.30 8.90 3.70 5.08 1.30 all dimensions in mm obsolete product(s) - obsolete product(s)
t2035h series ordering information 9/10 4 ordering information 5 revision history part number marking package weight base qty packing mode t2035h-600g t2035h-600g d 2 pak 1.5 g 50 tube t2035h-600g-tr t2035h-600g d 2 pak 1.5 g 1000 tape and reel t2035h-600trg t2035h-600t to-220ab 2.3 g 50 tube T2035H-600IRG t2035h-600i to-220abins 2.3 g 50 tube date revision changes 13-jul-2006 1 initial release. 7-sep-2006 2 added to-220ab insulated package. obsolete product(s) - obsolete product(s)
t2035h series 10/10 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2006 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com obsolete product(s) - obsolete product(s)
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